Semiconductor dummy chip
We will manufacture according to the client's specifications.
The wafer size is a maximum of 4 inches, with a thickness of 200 to 500 μm. The electrode materials include Al, Al-Si-Cu, and Al-Cu, among others. The formation of SiN and photolithography is possible, and the formation of Au bumps and dicing can be done for supplied wafers up to a maximum of 8 inches. Dicing and tray packing will also be performed.
- Company：オプトテクノ
- Price：Other
